Polish version

Login form

register


Print

D. Chmielewska, M. Barczewski, T. Sterzyński

A new method of curing epoxy resin by using bis(heptaphenylaluminosilsesquioxane)

as a hardener

Polimery 2013, No 4, 270


DOI: dx.doi.org/10.14314/polimery.2013.270

Summary

The curing process of epoxy resin Epidian 6 with bis(heptaphenylaluminosilsesquioxane) was studied. The curing conditions for the defined compositions were established on the basis of measurements made during the crosslinking reaction. Differential scanning calorimetry (DSC) was used to determine the temperature of the exothermal reaction related to the course of the curing process. Also, the temperature of crosslinking process and gel time at ambient temperature were determined. The homogeneity of the distribution of POSS additives in the epoxy matrix was investigated using microscopic analysis (SEM). Fourier transform infrared (FT-IR) spectroscopy was used to evaluate the chemical changes in the resin. It was shown that bis(heptaphenylaluminosilsesquioxane) can be applied as a curing agent for epoxy resins, with the main advantages of a low curing temperature and long life time.


Key words: epoxy resin, POSS, thermal analysis, crosslinkingts

e-mail: danuta.chmielewska@doctorate.put.poznan.pl

D. Chmielewska, M. Barczewski, T. Sterzyński (378.6 KB)
A new method of curing epoxy resin by using bis(heptaphenylaluminosilsesquioxane) as a hardener