Polish version

Login form

register


Print

B. Mossety-Leszczak, P. Ostyńska, M. Dutkiewicz, H. Maciejewski, H. Galina

Curing of epoxy resin epidian® 6 containing reactive organosilicon filler

— a differential scanning calorimetry study

Polimery 2013, No 3, 212


DOI: dx.doi.org/10.14314/polimery.2013.212

Summary

The curing reaction of epoxy resin Epidian 6 with or without an addition of reactive filler, octakis-[(3-glycidoxypropyl)dimethylsiloxy]octasilsesquioxane (POSS-OG), was investigated using differential scanning calorimetry (DSC). The curing agent was 4,4'-diaminodiphenylmethane (DDM). Based on the analysis of the thermograms recorded at different heating rates the kinetics of curing reactions in the examined systems was determined using the Model Free Kinetics method. The experimental results obtained by DSC isothermal analysis in the temperature range 60—160 °C, with temperature modulation TOPEM®, were used to construct TTT (time-temperature-transformation) diagram for epoxy resin Epidian 6 compositions with or without POSS-OG.


Key words: epoxy resins, silsesquioxanes, curing reaction, TTT diagram

e-mail: mossety@prz.edu.pl

B. Mossety-Leszczak, P. Ostyńska, M. Dutkiewicz, H. Maciejewski, H. Galina (145.8 KB)
Curing of epoxy resin epidian® 6 containing reactive organosilicon filler — a differential scanning calorimetry study