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O. G. Charachas, V. A. Firsov, Z. Łazowski, P. Myśliński, P. Penczek, A. F. Voloskin, J. S. Zajcev

Epoxide moulding compounds for microelectronics

Polimery 1989, No 5, 204

DOI: dx.doi.org/10.14314/polimery.1989.204


On the basis of published papers and patents, the requirements to be met by integrated circuits encapsulated with epoxide moulding compounds in microelectronics to ensure their operational reliability have been discussed. A particular attention has been paid to the synthesis of epoxide resins with a high degree of purity (free of ionic impurities and hydrolyzing chlorine), purity of fillers (in particular the absence of radioactive impurities) and danger of corrosion of aluminium conducting-pathes.

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