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A. M. Wróbel, M. R. Wertheimer

Etching of polymeric materials in low-temperature plasma

Polimery 1989, No 11, 483

DOI: dx.doi.org/10.14314/polimery.1989.483


Plasma-etching of five widely used commercial polymers: polyimide (Kapton „H”), polyamide (Nylon 66), polyester (Mylar), polycarbonate (Lexan) and cured epoxy resin (Epoxy DER 566-ABD, FR-4), bas been investigated. Etching has been carried out mostly in microwave (2.45 GHz) plasma generated in an oxygen-tetrafluoromethane mixture. To optimize this process, the effect of such operating parameters as pressure, etchant gas composition, plasma excitation frequency and temperature of polymeric sample upon etching ra te has been examined. Sharp maxima appeared in the curves representing etching ra te versus pressure of CF4/O2 mixture and its CF4 concentration. The temperature dependences proved that etching is a thermally activated process in all cases. The activation energy values obtained from the Arrhenius plot fall in the range from 0.04 (epoxy resin) to 0.2 eV (polyimide). The correlation between the polymer structure and activation energy of etching has been observed.

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