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A. Leistner, E. Fabrycy, J. Wagner, J. Leistner, A. Błędzki

High-temperature-resistant adhesives based on epoxy and bismethacrylate interpenetrating networks

Polimery 1998, No 11-12, 691

DOI: dx.doi.org/10.14314/polimery.1998.691


A low-molecular-weight epoxy resin A 1900 (diglicydyl ether of bisphenol A) was modified with bismethacrylate of diglycidyl ether of bisphenol A (monomer Bis-GMA) by simultaneous, radical and ionic, polymerization of the two components to yield an interpenetrating epoxide and acrylate polymer network. DSC and DTMA were used to characterize the networking process. Three IPN compositions (containing 50, 60 or 70% by wt. of resin A 1900) and homopolymers of the two components (Table 1) were examined. The kinetic parameters (energy of activation E, pre-exponential factor Z, and order of reaction n (cf. Table 2) were established and used to describe the course of the networking process at a selected constant temperature (Figs. 2 and 3). Thermal (Table 3) and mechanical properties (Table 4) of the products were examined. The composition IPN-3 containing 30% of the monomer Bis-GMA proved to be the best in terms of the networking rate and properties (Tables 3, 4). This composition was used to join polyimide/copper composites. The adhesive based on this composition appears to be applicable in the electrotechnical, electronic and aviation industries.

Keywords: interpenetrating polymer (epoxide-acrylate) networks (IPN), kinetics of networking process, thermal and mechanical properties of networked products, epoxy adhesives

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