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A. Błędzki, A. Kwasek


Imidazoles as curing agents for epoxide compositions


Polimery 1982, No 8, 297



DOI: dx.doi.org/10.14314/polimery.1982.297

Summary

A new group of 2-methylimidazole derivatives has been used in the studies. It has been found that independently on the type of substituent in position 1 of the 2-methylimidazole ring, curing of epoxide resins with all the derivatives studied takes place at 90—150°C, although with various ra­tes. Changes in the temperature of gelation in the range of 150—160°C have no distinct effect of the course of the curing process. All the cured compositions studied decompo­se practically only above 300°C. The reaction of Imidazo­les studied with epoxide resins is sufficiently rapid for their use as curing agents of epoxide moulding compounds at 150°C. The epoxide moulding compounds curerd with imidazoles exhibit good mechanical and electrical properties.


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