Investigations on the improvement of properties of low-pressure epoxide moulding compounds
for electrotechnical applications
The possibility of improving the mechanical properties and flowability of low-pressure epoxide moulding compounds used in the electronics industry by a proper selection of curing system and filling agents Has been investigated. An increase in flexural strength, ten sile load at break and hardness as well as an improvement in the dynamic mechanical properties and flowability has been obtained without deterioration of the electrical properties.
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