New aromatic diamine-based deep eutectic solvents designed for epoxy resin curing (Rapid Communication)
Polimery 2018, No 6, 453
New deep eutectic solvents (DESs) based on choline chloride (ChCl) and aromatic amines: m-phenylenediamine (MPDA) and 2,4-diaminotoluene (DAT) were prepared for the first time and applied for bisphenol A-based low molecular epoxy resin curing. Some physicochemical features of both DESs were presented and discussed on a basis of literature data. Curing process of epoxy compositions with stoichiometric and substoichiometric amounts of amine hydrogens was characterized via differential scanning calorimetry (DSC). The resulting cured materials possess acceptable thermomechanical properties. Advantages of DES based on ChCl and MPDA allowed to determine possible application areas of this epoxy resin curing agents.