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E. Fabrycy


The effect of aluminium – corrosion inhibitors on the performance of electronic subassemblies encapsulated

with epoxy moulding materials

Polimery 1993, No 4-5, 194


DOI: dx.doi.org/10.14314/polimery.1993.194

Summary

Epoxy moulding materials used in the electronic industry were modified by adddition of small amounts (up to 1.25 mass-% per epoxy resin) of inorganic or organic chemical compounds inhibiting corrosion of aluminium. The effect of such compounds on the quality of integrated circuits encapsulated with Epolit 120 and Epolit 1125 moulding materials was determined. By addition of some quinones the durability of printed circuits increased several times under conditions of the Pressure Cooker Test at 121°C, under steam pressure of 1.2 atm (0.12 MPa). This proves the possibility of a multiple prolongation of the period of a faultless service of integrated circuits under normal conditions.


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