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K. Starzyńska, W. Paszkiewicz


Weather-and mildew-resistant chipboard. RAPID COMMUNICATION (in English)

Polimery 1992, No 11-12, 552


DOI: dx.doi.org/10.14314/polimery.1992.552

Summary

A urea-melamine-phenol-formaldehyde resin was developed at the Chemical Industry Research Institute and implemented in commercial scale in the ERG Plastics Works at Pustkow. This resin was applied as binder in air fractionated, slow-burning, weather- and mildew-resistant chipboards of the E-1 hygienicity class. In the production of chipboards exclusively wood waste formed in the plywood manufacturing process was used. These boards were admitted in the building-industry applications as components of roof covering and wall, floor and ceiling panels.


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