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W. Mazela, P. Czub, J. Pielichowski

Application of epoxy resins in electronics and optoelectronics.

Part I. Mechanical properties and thermal stability of epoxy resins used

for encapsulation of electronic devices

Polimery 2004, No 4, 233


Summary

The problems concerning electronic circuitry encapsulation with epoxy resins (EP resins) were discussed in this literature review. Types of most important components of epoxy molding compounds as well as their functions in the epoxy systems and requirements concerning them were presented. In the encapsulated semiconductor structure an analysis of the spots of internal stresses occurrence and the reasons of them causing the microcircuit system damage were presented. As well the current directions of research on new EP resins warranting the operational reliability of the integrated circuits produced recently, fulfilling the requirements of new technologies of electronic industry. There is also presented a review of modified epoxy molding compounds characterized with small values of flexural modulus and the same time as high as possible glass transition temperature allowing to keep small value of the coefficient of thermal expansion. Modification has been carried out by introducing of flexible domains or biphenyl segments to EP matrix.


Keywords: epoxy resins, epoxy molding compounds, integrated circuits, encapsulation, modification, internal stresses


W. Mazela, P. Czub, J. Pielichowski

Application of epoxy resins in electronics and optoelectronics. Part I. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices