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E. Hałasa

Liquid epoxy resins for encapsulation of integrated circuits elements

Polimery 2004, No 9, 595


Summary

In a review the general criteria of selection of polymers suitable for encapsulation of integrated circuits (IC) elements have been presented. The compositions (types of resins, curing and accelerating agents) and properties (shrinkage and internal stresses, adhesion) of epoxy systems used for this purpose were discussed. Various variants of casting method, especially glob-top one have been characterized among various encapsulation processes. Practical aspects of epoxy resins' using to encapsulation of IC elements were described.


Keywords: encapsulation, epoxy compositions, integrated circuits, encapsulating coatings' properties


E. Hałasa

Liquid epoxy resins for encapsulation of integrated circuits elements